Objective：
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IC Chip Package Inspection
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Chip Epoxy Fillet Height Detection
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Die Tilt, Thickness & Wetting Inspection
Chip Epoxy Fillet Height & Die Tilt, Thickness & Wetting
Epoxy Thickness & Die Tilt
銀膠出水厚度 與晶片傾角
2D薄膜出水範圍量測
3D 銀膠出水量測
Chip and Epoxy Fillet Height Profile
Die Shift Measurement
定位偏移
Die Shift Measurement
定位偏移計算
Chip Die 3D Model View
